Substrate name: Ceramic Substrate Metallization
Substrate material thickness: 0.65mm
Conducting layer: Cu
Thickness of metal layer: 200μm
Surface preparation: OSP
Metal single-sided / double sided: double sided
Copper plated through hole: yes
Solder mask: yes
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Ceramic Substrate Metallization
- Company ProfileFolysky Technology (Wuhan) Co., Ltd
- Product Brand斯利通
- RegionChina
- CategoryElectronic Components & Supplies - Other PCB & PCBA
- MashupChina Electronic Components & Supplies - China Other PCB & PCBA
- RelatedCeramic Pcb
Product Details

Contact Information
- Contact Personzhao
- Telephone86 - 27 - 88111056
- Fax Number
- Websitehttps://www.gmdu.net/corp-919887.html
- Post Code
- AddressWu Da Yuan Road, Wuhan, Hubei, China
- Online MapFolysky Technology (Wuhan) Co., Ltd Map & Directions
Related ProductsFolysky Technology (Wuhan) Co., Ltd
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