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Compass Technology Co., Ltd.

Business TypeManufacturer
Main MarketsNorth America South America Eastern Europe Eastern Asia Western Europe
Product/ServiceFPC,TBGA,Camera Module,Flexible PCB,FPC Assembly,COF,CSP,Finger Printed Sensor Module,Smart Card Module,Display Module
Business OwnerMr. Chee-wah Cheung
Employees501 - 1000 People
RegionHong Kong
Last Modified2010-08-10 00:51:19UTC

Company Introduction

Compass Technology Company Limited, founded in June, 1997, 1ff8is a dynamic manufacturer of flexible substrates (FPC/ TAB/ COF) and is backed by strong management and technical personnel with years of production experience in the high end industry. With Compass Technology Company Limited, you will always have the competitive advantage. Due to highly advanced production equipment and skilled workforce, we are able to respond quickly to your needs, even to the most demanding industrial specifications.Our Edge: We have a Japanese manufacturing technology with Hongkong production flexibility to achieve superior quality with less overall cost. Compass's state-of-art automated reel to reel production lines with fine pitch capabilities (8um width/ 8um spacing) is a show case in Hongkong to serve the FPC industry. We fully understand and emphasize on the importance of time to the mass production and time to market. We are always customer driven with a focus on continuous improvement to enhance our technology to meet rapid changing industrial requirements. Clean Room Environment: World class clean-room facilities designed at class 1K. Vision: To be the best among the world class suppliers of high density interconnect IC assembly packaging materials.Philosophy: Do it right the First time, On time and Every time. Application: Flexible Substrates ( FPC, TAB, COF, TCP, LCD Driver, Flip Chip, TBGA, mBGA, m*BGA, CSP, MCM)Area: HK-154,400 ft2. (14,360m2) China (Shenzhen) - (2,500m2)Paid-up Capital: HK$550M (US$70M)University Collaborations:-Georgia Institute of Technology (Package Research Center) on Research and development in advance packaging materials - City University of Hong Kong (EPA Center) for Failure Analysis, Reliability Testing (including test on plated blind &/or through vias) and Tape Substrate Functional Testing- Hong Kong Polytechnic University (PCB Technology Transfer Unit) for Via formation by UV YAG or CO2 laser drilling on blind and through hole (direct dielectric, conformal mask, cu-foil drilling/conformal mask laser drilling technique), Laser drilling on 2metal & multi-layer PI substrates Development. - Chinese University of Hong Kong (ASMAC) for Electrolysis metal surface finishing analysis (analysis on Au & Ni plating chemistries and evaluation of resulting surface finish), Blind & through hole plating development on 2-metal and multi-layer substrates.- Xiamen University (China) with Department of Chemistry & Institute of Physical Chemistry on Metal Finish Process Study and Development and Plating Solution Analysis/ Maintenance.

Contact Information

Contact PersonMr. BRIAN CHAN
Telephone00-852-26888925
Fax Number00-852-26365626
Website
Post Code
AddressSUITE 10, 5/F, CHIAPHUA CENTRE, 12 SIU LEK YUEN RD, SHATIN, NT, HK, Hong Kong
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